Description
High-precision double shaft BGA clamp designed for stable IC contact during motherboard repairs.
Description
1. Compatible with iPhone X to 13 Pro Max
2. Universal design fits various chip sizes and board layouts
3. Features double-shaft locking mechanism for extra grip and accuracy
4. Ideal for BGA reballing, IC replacement, and chip-level diagnostics
5. Built with durable, heat-resistant materials for repeated professional use